This study aimed to design and numerically evaluate eleven perforated-fin heat sink configurations using computational fluid dynamics (CFD) simulations in SolidWorks Flow Simulation for microprocessor cooling applications. The configurations were manufactured from Aluminum 6061 and included conventional solid-fin reference designs and modified designs incorporating circular and elliptical perforations with different geometric arrangements. The simulations were performed under forced-convection conditions within a desktop computer enclosure equipped with cooling fans providing an airflow velocity of 7.9 m/s. An Intel® Core™ i7-9700K microprocessor with a thermal design power (TDP) of 95 W was considered as the heat source. The thermo-hydraulic performance of each configuration was assessed in terms of pressure drop, average heat sink temperature, maximum temperature, convective heat transfer coefficient, and thermal resistance. The results demonstrate that the incorporation of perforations enhances the thermal performance of conventional heat sink designs by promoting a more uniform airflow distribution and improving convective heat transfer. The best overall performance was achieved by the DPA-4 configuration, consisting of rectangular fins with linearly arranged circular perforations, which exhibited the lowest average temperature (40.29 °C), the highest convective heat transfer coefficient (55.91 W/m²·K), and the lowest thermal resistance (0.2029 K/W). The DPA-6 configuration exhibited the lowest maximum temperature (53.12 °C). Heat sinks with elliptical perforations also showed significant thermal improvement compared with the conventional solid-fin design, whereas variations in the inclination angle produced only minor effects on thermal performance. Furthermore, the maximum variation in pressure drop was limited to approximately 0.9%, indicating that the thermal enhancements were achieved without significant hydraulic penalties. These findings demonstrate that geometric optimization through fin perforation is an effective strategy for improving the thermo-hydraulic performance of heat sinks for electronic cooling applications.